DocumentCode

315481

Title

Fabrication of CSO Interposer Using 96% Alumina Substrate

Author

Mohri, Mamoru ; Miyakoshi, Motoharu ; Kidani, Naoki ; Kado, Takashi

fYear

1997

fDate

16-18 April 1997

Firstpage

393

Lastpage

396

Keywords

Ceramics; Chip scale packaging; Circuits; Conductors; Costs; Fabrication; Joining processes; Substrates; Thermal resistance; Thick films;

fLanguage

English

Publisher

ieee

Conference_Titel

IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]

Conference_Location

IEEE

Print_ISBN

0-7803-4235-6

Type

conf

Filename

619044