DocumentCode
315482
Title
Development Of A New Leadframe-type Chip Scale Package
Author
Chiang, C.L. ; Huang, H.C. ; Lee, R.S. ; Cheng, P.H.
fYear
1997
fDate
16-18 April 1997
Firstpage
397
Lastpage
400
Keywords
Chip scale packaging; Costs; Electronic packaging thermal management; Electronics packaging; Lab-on-a-chip; Lead; Semiconductor device packaging; Thermal conductivity; Thermal resistance; Transfer molding;
fLanguage
English
Publisher
ieee
Conference_Titel
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location
IEEE
Print_ISBN
0-7803-4235-6
Type
conf
Filename
619045
Link To Document