DocumentCode

315484

Title

Chip Scale Package Using Standard Lead Frame Technology

Author

Shin, Won Sun ; Yoon, Ju Hoon ; Kwak, Sung Bum ; Han, Byung Joon

fYear

1997

fDate

16-18 April 1997

Firstpage

407

Lastpage

411

Keywords

Assembly; Chip scale packaging; Electronics industry; Electronics packaging; Etching; Lab-on-a-chip; Lead; Packaging machines; Soldering; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]

Conference_Location

IEEE

Print_ISBN

0-7803-4235-6

Type

conf

Filename

619047