Title :
Chip Scale Package Using Standard Lead Frame Technology
Author :
Shin, Won Sun ; Yoon, Ju Hoon ; Kwak, Sung Bum ; Han, Byung Joon
Keywords :
Assembly; Chip scale packaging; Electronics industry; Electronics packaging; Etching; Lab-on-a-chip; Lead; Packaging machines; Soldering; Wire;
Conference_Titel :
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location :
IEEE
Print_ISBN :
0-7803-4235-6
