DocumentCode
315485
Title
Characterizing Two Metal Tbga
Author
Gengel, Glenn ; Goetz, Martin, Jr.
fYear
1997
fDate
16-18 April 1997
Firstpage
412
Lastpage
415
Keywords
Assembly; Copper; Electronics packaging; Heat sinks; Optical materials; Polyimides; Routing; Semiconductor device packaging; Substrates; Thermal conductivity;
fLanguage
English
Publisher
ieee
Conference_Titel
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location
IEEE
Print_ISBN
0-7803-4235-6
Type
conf
Filename
619048
Link To Document