DocumentCode :
3155783
Title :
RF MEMS integration present & future trends
Author :
Polla, Dennis L. ; Wolfson, Michael B.
Author_Institution :
Defense Adv. Res. Projects Agency, Arlington, VA, USA
fYear :
2009
fDate :
Jan. 9 2009-Dec. 11 2009
Firstpage :
5
Lastpage :
7
Abstract :
RF MEMS technologies are rapidly being integrated into RF subsystems for a variety of applications of interest to the Department of Defense. New technologies such as RF high-Q MEMS resonators and micromechanical arrays are being developed that will enable filters and other high-performance passive components for fully integrated microsystems. Large off-chip filters will be replaced by arrays of MEMS resonators to enable monolithic chip-scale spectrum analyzers and channelizer. RF MEMS switches are being continually improved for low-loss, high-isolation switching with enhanced reliability critical to the performance of both military and commercial systems.
Keywords :
micromechanical resonators; microswitches; microwave filters; spectral analysers; Department of Defense; MEMS resonators; RF MEMS switches; RF high-Q MEMS resonators; filters; integrated microsystems; micromechanical arrays; monolithic chip-scale channelizer; monolithic chip-scale spectrum analyzers; Impedance matching; Micromechanical devices; Nanoelectromechanical systems; Physics; Q factor; Radio frequency; Radiofrequency microelectromechanical systems; Resonator filters; Switches; USA Councils; Impedance matching; Q factor; interface phenomena; micromechanical signal processor arrays; microresonators; microwave filters; microwave switches;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Radio-Frequency Integration Technology, 2009. RFIT 2009. IEEE International Symposium on
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-5031-2
Electronic_ISBN :
978-1-4244-5032-9
Type :
conf
DOI :
10.1109/RFIT.2009.5383747
Filename :
5383747
Link To Document :
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