• DocumentCode
    315697
  • Title

    Whole-chip ESD protection design for submicron CMOS VLSI

  • Author

    Ker, Ming-Dou ; Liu, Shue-Chang

  • Author_Institution
    VLSI Design Dept., Ind. Technol. Res. Inst., Hsinchu, Taiwan
  • Volume
    3
  • fYear
    1997
  • fDate
    9-12 Jun 1997
  • Firstpage
    1920
  • Abstract
    A VDD-to-VSS ESD clamp circuit is designed to provide the real whole-chip ESD protection for submicron CMOS IC´s. The ESD-protection efficiency is experimentally verified to be dependent on the pin location of a chip. This whole-chip ESD protection design has been successfully implemented in a 0.8-μm CMOS IC product with a real pin-to-pin ESD protection of above 3 kV
  • Keywords
    CMOS integrated circuits; VLSI; electrostatic discharge; integrated circuit design; integrated circuit reliability; surge protection; 0.8 micron; 3 kV; VDD-to-VSS ESD clamp circuit; pin location; submicron CMOS VLSI; whole-chip ESD protection design; CMOS integrated circuits; Clamps; Electrostatic discharge; Integrated circuit modeling; MOS devices; Pins; Protection; Variable structure systems; Very large scale integration; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems, 1997. ISCAS '97., Proceedings of 1997 IEEE International Symposium on
  • Print_ISBN
    0-7803-3583-X
  • Type

    conf

  • DOI
    10.1109/ISCAS.1997.621526
  • Filename
    621526