• DocumentCode
    3159554
  • Title

    Grain boundaries in silicon: microstructure and minority carrier recombination

  • Author

    Krinke, J. ; Albrecht, M. ; Dorsch, W. ; Voigt, A. ; Strunk, H.P. ; Steiner, B. ; Wagner, G.

  • Author_Institution
    Inst. fur Werkstoffwissenschaften, Erlangen-Nurnberg Univ., Germany
  • fYear
    1996
  • fDate
    13-17 May 1996
  • Firstpage
    473
  • Lastpage
    476
  • Abstract
    The authors investigate the correlation between the microstructure and the minority carrier recombination of grain boundaries in thin silicon films solution grown with liquid phase epitaxy on cast silicon. We directly correlate electron beam induced current measurements with transmission electron microscope investigations identical grain boundaries in the epitaxial layers. The electrical recombination activity of grain boundaries may be caused or influenced by the microstructure, i.e. precipitates, dislocations and the atomic arrangement. Our investigations reveal that symmetric tilt boundaries show a much lower minority carrier recombination than asymmetric or microfaceted tilt boundaries
  • Keywords
    EBIC; dislocation structure; electron-hole recombination; elemental semiconductors; grain boundaries; liquid phase epitaxial growth; minority carriers; semiconductor epitaxial layers; silicon; tilt boundaries; transmission electron microscopy; Si; dislocations; electrical recombination activity; electron beam induced current; grain boundaries; liquid phase epitaxy; microfaceted tilt boundaries; microstructure; minority carrier recombination; precipitates; symmetric tilt boundaries; thin Si films; transmission electron microscope; Current measurement; Electron beams; Epitaxial growth; Epitaxial layers; Grain boundaries; Microstructure; Semiconductor films; Silicon; Spontaneous emission; Transmission electron microscopy;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Specialists Conference, 1996., Conference Record of the Twenty Fifth IEEE
  • Conference_Location
    Washington, DC
  • ISSN
    0160-8371
  • Print_ISBN
    0-7803-3166-4
  • Type

    conf

  • DOI
    10.1109/PVSC.1996.564046
  • Filename
    564046