DocumentCode :
3160885
Title :
Simulated and Experimental Thermal Analysis of Home Entertainment Server
Author :
Boon, Chong Nyok ; Yong, Law Sie ; Kong, Foong Foo ; Jong, Kim Han ; Hong, Ong Eng
Author_Institution :
Data Storage Inst., Singapore
fYear :
2007
fDate :
10-12 Dec. 2007
Firstpage :
888
Lastpage :
891
Abstract :
This paper describes the simulated and experimental thermal analysis of a home entertainment server (home server). Heat dissipation per unit area in consumer electronics is set to increase tremendously with increasing product functions and the trend of slimmer, smaller and aesthetic looking in product design. This trend poses a challenge to thermal management of such products. To ensure good reliability and functionality, thermal design and thermal simulation for our home server have been carried out prior to prototyping. Simulated temperatures of two hard disk drives (HDDs), central processing unit (CPU) obtained from the thermal analysis are 38.4, 40.2 and 78.5degC respectively. Temperature measurement results show good agreement with simulated results with an average error of 10%. Both measurement and simulated results of HDDs and CPU fall within their recommended working temperature regime.
Keywords :
consumer electronics; disc drives; hard discs; microprocessor chips; thermal analysis; thermal management (packaging); central processing unit; consumer electronics; hard disk drives; heat dissipation; home entertainment server; product design; reliability; temperature 38.4 C to 78.5 C; thermal analysis; thermal management; Acoustic noise; Analytical models; Central Processing Unit; Computational modeling; Consumer electronics; Network servers; Product design; Temperature measurement; Thermal engineering; Thermal management;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-1323-2
Electronic_ISBN :
978-1-4244-1323-2
Type :
conf
DOI :
10.1109/EPTC.2007.4469732
Filename :
4469732
Link To Document :
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