DocumentCode :
3160913
Title :
IC-Compatible Low Loss Passive Circuits for Millimeter-Wave Applications
Author :
Bouchriha, Fouad ; Dubuc, David ; Grenier, Katia ; Plana, Robert
Author_Institution :
LAAS-CNRS, Univ. de Toulouse
fYear :
2006
fDate :
10-15 Sept. 2006
Firstpage :
380
Lastpage :
383
Abstract :
This paper reports a novel low-loss and IC-compatible technological solution to improve coplanar passive circuit´s performances on low-resistivity silicon substrate (LRS) in order to demonstrate the feasibility of tailoring locally the silicon substrate to speed up the performance of a system. Both EM-simulations and high-frequency characterizations have shown an important benefit in CPW circuits performances by combining bulk silicon micromachining technique and low-k polymer membrane. An attenuation coefficient of 0.57 dB/cm is obtained at 20 GHz with this technique in the case of a CPW line on 20-30 Omega.cm silicon substrates. The V-band suspended CPW band-pass filter on BCB membrane has shown 3.6 dB insertion loss improvement compared to those realized on top of bulk high-resistivity (HR) silicon substrate with thick polymer interface layer
Keywords :
band-pass filters; coplanar waveguide components; low-k dielectric thin films; micromachining; millimetre wave filters; polymer films; silicon; waveguide filters; 20 GHz; BCB membrane; CPW circuits; EM simulations; IC-compatible technological solution; Q-factor; V-band suspended CPW; band-pass filter; bulk silicon micromachining technique; coplanar passive circuit; high-frequency characterizations; insertion loss improvement; low loss passive circuits; low-k polymer membrane; thick polymer; Attenuation; Band pass filters; Biomembranes; Coplanar waveguides; Micromachining; Millimeter wave integrated circuits; Millimeter wave technology; Passive circuits; Polymers; Silicon; BCB; CPW; Q-factor; Thick polymer; band-pass filters; micromachining; mm-wave; silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Conference, 2006. 36th European
Conference_Location :
Manchester
Print_ISBN :
2-9600551-6-0
Type :
conf
DOI :
10.1109/EUMC.2006.281353
Filename :
4057829
Link To Document :
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