Title :
90 Degree Tandem Hybrid with Tolerance to Displacement Error and Thickness Variation in Multi-layered Substrate
Author :
Yuasa, Takeshi ; Tahara, Yukihiro ; Oh-hashi, Hideyuki
Author_Institution :
Mitsubishi Electr. Corp., Kamakura
Abstract :
90 degree coupled-line hybrid that is tolerant to manufacturing errors in a multi-layered substrate has been developed. The tolerance to displacement error and thickness variation in the multi-layered substrate can be achieved by using diagonally shifted coupled lines with adjacent ground walls. It has been demonstrated that the coupling characteristics of the hybrids fabricated in LTCC agree well with designed ones and their deviation is very small
Keywords :
ceramic packaging; hybrid integrated circuits; integrated circuit packaging; substrates; LTCC; coupled-line hybrid; diagonally shifted coupled lines; displacement error; multilayered substrate; tandem hybrid; thickness variation; Circuit optimization; Conductors; Coupling circuits; Degradation; Dielectric losses; Dielectric substrates; Manufacturing; Production; Radio frequency; Strips; error; hybrid; multi-layered substrate;
Conference_Titel :
Microwave Conference, 2006. 36th European
Conference_Location :
Manchester
Print_ISBN :
2-9600551-6-0
DOI :
10.1109/EUMC.2006.281428
