DocumentCode :
3161747
Title :
Package capacitors impact on microprocessor maximum operating frequency
Author :
Waizman, Alex ; Chung, Chee-Yee
Author_Institution :
MTM Center, Intel Israel, Haifa, Israel
fYear :
2001
fDate :
2001
Firstpage :
118
Lastpage :
122
Abstract :
This paper discusses the behavior of microprocessor (CPU) maximum operating frequency (FMAX) under various conditions. In specific, the impact of voltage and temperature on the CPU FMAX for a gate delay dominated design vs. an RC-interconnect delay dominated design are described. As voltage tolerance is reduced through proper design placement of package capacitors, and using the optimal amount of capacitance and resistance (ESR) for the package capacitors, the CPU FMAX increases
Keywords :
capacitors; integrated circuit packaging; microprocessor chips; CPU FMAX; RC interconnect delay; design methodology; gate delay; maximum operating frequency; microprocessor; package capacitor; voltage tolerance; Algorithm design and analysis; Capacitance; Capacitors; Central Processing Unit; Delay effects; Design methodology; Frequency; Microprocessors; Packaging; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2001. Proceedings., 51st
Conference_Location :
Orlando, FL
ISSN :
0569-5503
Print_ISBN :
0-7803-7038-4
Type :
conf
DOI :
10.1109/ECTC.2001.927705
Filename :
927705
Link To Document :
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