Title :
Theoretical Stress Calculation and Experimental Results of "NCF-type Compliant-Bumped COG"
Author :
Chen, Ming-Yao ; An, Chao-Chyun ; Chang, Shyh-Ming ; Kao, Kuo-Shu ; Tsang, Jimmy ; Yang, Sheng-Shu ; Chen, Chih ; Lin, Chung-Kuang
Author_Institution :
Taiwan TFT LCD Assoc., Hsinchu
Abstract :
Non-conductive-film (NCF) bonding method ensures the micro-order direct bonding between the IC electrode and circuit substrate electrode. The binding force of the applied adhesive achieves electrical connections between the bumps on the IC chip and the electrodes on the substrate. The stress analysis results are used to identify the appropriate temperature range for the given NCF bonding structure. Both analytical and experimental results demonstrate the feasibility of using the compliant bumps to achieve a high compressive stress and low, and stable connection resistance at various environmental temperatures. In addition, the reliability test results will be discussed.
Keywords :
bonding processes; chip scale packaging; fine-pitch technology; integrated circuit interconnections; integrated circuit reliability; liquid crystal displays; stress analysis; IC chip; IC electrode; NCF bonding structure; NCF-type compliant- bumped COG; chip-on-glass technology; circuit substrate electrode; environmental temperature; high compressive stress; microorder direct bonding; nonconductive-film bonding method; reliability test; stable connection resistance; stress analysis; super fine pitch COG bonding process; theoretical stress calculation; Bonding; Electrodes; Electronic equipment testing; Glass; Integrated circuit layout; Integrated circuit modeling; Solid modeling; Substrates; Temperature; Thermal stresses;
Conference_Titel :
Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-1323-2
Electronic_ISBN :
978-1-4244-1323-2
DOI :
10.1109/EPTC.2007.4469816
