Constitutive Properties of Bulk Solder at `Drop-Impact´ Strain Rates

Author

Selvanayagam, C.S. ; Wong, E.H. ; Seah, S.K.W. ; van Driel, W.D. ; Caers, J. F J M ; Zhao, X.J. ; Owens, N. ; Tan, L.C. ; Frear, D.R. ; Leoni, M. ; Lai, Y.-S. ; Yeh, C.-L.

Author_Institution

Inst. of Microelectron., Singapore

fYear

2007

fDate

10-12 Dec. 2007

Firstpage

360

Lastpage

364

Abstract

Medium strain rate (0.1/s to 300/s) constitutive properties are needed for accurate modeling of drop impact conditions. This study presents an experimental procedure for obtaining the material properties of solder alloys at these medium strain rates. The effect of grain size on the medium strain rate behavior of solder alloys is also studied, using SnPb alloy as an example. Grain size variation is achieved through different aging conditions. For the lower strain rates tested, yield stress generally increases with aging. Interestingly, for the higher strain rates, the yield stress decreases with less severe aging but increases with more severe aging. In addition, aging causes a decrease in the strain rate sensitivity of the solder.

Keywords

ageing; impact testing; lead alloys; solders; tin alloys; SnPb; SnPb alloy; aging; bulk solder; constitutive properties; drop impact conditions; drop-impact strain rates; material properties; medium strain rates; solder alloys; Aging; Capacitive sensors; Frequency; Grain size; Material properties; Mechanical factors; Microstructure; Stress; Temperature; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th

Conference_Location

Singapore

Print_ISBN

978-1-4244-1323-2

Electronic_ISBN

978-1-4244-1323-2

Type

conf

DOI

10.1109/EPTC.2007.4469817

Filename

4469817