Title :
An integrated, wireless microinstrument for monitoring skin temperature
Author :
Salman, Z.K. ; Jones, S.H. ; Weikle, R.M. ; Aylor, J.H.
Author_Institution :
Dept. of Electr. Eng., Virginia Univ., Charlottesville, VA, USA
Abstract :
This paper describes the initial design, construction and testing of an integrated, wireless, temperature microsensor designed to monitor skin temperature and transmit the information to a local receiver using a 350 MHz carrier frequency. The sensor chip measures 4.6 mm by 6.8 mm and is fully self-contained, incorporating the sensing circuitry as well as a microantenna on chip. The chip is fabricated in a 2.0 micron, twin-metal, twin-poly, N-well, BiCMOS process technology provided by the DARPA MOSIS fabrication service
Keywords :
BiCMOS integrated circuits; application specific integrated circuits; biomedical electronics; biomedical equipment; biomedical telemetry; biothermics; electric sensing devices; patient monitoring; radiotelemetry; temperature measurement; 2 micron; 350 MHz; DARPA MOSIS fabrication service; N-well BiCMOS process technology; integrated wireless microinstrument; onchip microantenna; onchip sensing circuitry; sensor chip; skin temperature monitoring; temperature microsensor; twin-metal twin-poly process; Circuit testing; Frequency; Integrated circuit measurements; Microsensors; Monitoring; Semiconductor device measurement; Skin; Temperature measurement; Temperature sensors; Wireless sensor networks;
Conference_Titel :
ASIC Conference and Exhibit, 1996. Proceedings., Ninth Annual IEEE International
Conference_Location :
Rochester, NY
Print_ISBN :
0-7803-3302-0
DOI :
10.1109/ASIC.1996.551972
