DocumentCode :
3163849
Title :
Temperature Control In Wafer-level Testing Of Large Multi-segment Electromigration Test Structures
Author :
Zamani, Nasser ; Lin, Yu-Sang
Author_Institution :
California Institute Of Technology
fYear :
1988
fDate :
22-23 Feb. 1988
Firstpage :
138
Lastpage :
142
Keywords :
Electromigration; Heating; Isothermal processes; Metallization; Monitoring; Temperature control; Temperature measurement; Temperature sensors; Testing; Thermal resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microelectronic Test Structures, 1988. ICMTS. Proceedings of the 1988 IEEE International Conference on
Conference_Location :
Long Beach, CA, USA
Type :
conf
DOI :
10.1109/ICMTS.1988.672949
Filename :
672949
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3163849
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