Title :
500 k transistor custom BiCMOS LSI using automated macrocell design
Author :
Yoshimura, Hiroshi ; Horiguchi, Shoji ; Takeya, Ken ; Ishikawa, Keiji ; Date, Shigeru ; Muramoto, Susumu ; Yoshino, Hideo
Author_Institution :
NTT, Atsugi, Japan
Abstract :
A high-density and quick-turnaround macrocell design method for custom VLSIs is applied to a 500 k-transistor protocol control chip, resulting in a density of about 4000 transistors/mm/sup 2/ using 0.8- mu m BiCMOS technology. An automated adaptive macrocell and a short-time custom VLSI design methodology were developed to make the logic and physical design more adaptable by offering greater variety of bit width, word length, circuit type, and signal terminals. The adaptive macrocell generation procedure consists of a logical description and a physical description with minimum information on the composition of complete macrocells, suitable for all specific uses. The variables providing adaptability are parameterized in this procedure, which is hierarchically described by network information among leaf cells or submacrocells, together with their topological placement information, permitting the adaptive macrocell to be generated automatically. An example of an ALU (arithmetic logic unit) circuit generated as a data-path submacrocell is shown. To verify the effectiveness of the proposed method, various kinds of macrocells were generated and fabricated using the 0.8- mu m, double-metal BiCMOS technology. A packet communication control circuit supporting X.25-based layer 2 and 3 protocols, which was designed by this method, is presented.<>
Keywords :
BIMOS integrated circuits; VLSI; application specific integrated circuits; circuit CAD; data communication equipment; digital integrated circuits; logic CAD; packet switching; protocols; 0.8 micron; ALU; ASIC; CAD; X.25 based protocols; adaptive macrocell generation procedure; arithmetic logic unit; automated macrocell design; custom BiCMOS LSI; custom VLSI design methodology; data-path submacrocell; double-metal BiCMOS technology; high-density; layer 2 protocol; layer 3 protocol; leaf cells; logic IC; logical description; packet communication control circuit; physical description; protocol control chip; topological placement information; Automatic control; BiCMOS integrated circuits; Design methodology; Large scale integration; Logic circuits; Logic design; Macrocell networks; Protocols; Signal design; Very large scale integration;
Conference_Titel :
Solid-State Circuits Conference, 1989. Digest of Technical Papers. 36th ISSCC., 1989 IEEE International
Conference_Location :
New York, NY, USA
DOI :
10.1109/ISSCC.1989.48204