Fabrication of diamond mold for imprint lithography

Author

Konoma, C. ; Ono, T. ; Miyashita, H. ; Kanomori, Y. ; Esashi, M.

Author_Institution

Dept. Mechatronics & Precision Eng., Tohoku Univ., Sendai, Japan

fYear

2002

fDate

6-8 Nov. 2002

Firstpage

164

Lastpage

165

Abstract

The authors propose the fabrication method for a diamond mold for imprint lithography to transfer the dot pattern onto recording media. It is expected that more high density and small dot patterns will be imprinted using the diamond mold. A diamond thin film with a thickness of about 10 /spl mu/m was deposited on a Si wafer using hot-filament chemical vapor deposition (HF-CVD). The wafer with the diamond film was anodically bonded with 5 mm thick Pyrex glass via sputtered Al film as an adhesive layer. An aligned hole pattern can be successfully transferred on the diamond film by oxygen fast atom beam etching.

Keywords

adhesion; aluminium; chemical vapour deposition; diamond; elemental semiconductors; etching; hard discs; moulding; nanolithography; semiconductor thin films; silicon; 10 micron; 5 mm; Al; C; HF-CVD; O fast atom beam etching; Pyrex glass; Si; Si wafer; diamond mold; diamond thin film; dot pattern transfer; fabrication method; film thickness; hole pattern transfer; hot-filament chemical vapor deposition; imprint lithography; recording media; sputtered Al adhesive layer; Atomic beams; Atomic layer deposition; Chemical vapor deposition; Fabrication; Glass; Lithography; Semiconductor thin films; Sputter etching; Sputtering; Wafer bonding;

fLanguage

English

Publisher

ieee

Conference_Titel

Microprocesses and Nanotechnology Conference, 2002. Digest of Papers. Microprocesses and Nanotechnology 2002. 2002 International

Conference_Location

Tokyo, Japan

Print_ISBN

4-89114-031-3

Type

conf

DOI

10.1109/IMNC.2002.1178595

Filename

1178595