Title :
Electromechanical microswitches with thermal actuation
Author :
Ketterer, B. ; Bitnar, B. ; Haas, B. ; Neiger, T. ; Bachle, D. ; Glaus, F. ; Gobrecht, J.
Author_Institution :
Lab. for Micro- & Nanotechnology, Paul Scherrer Inst., Villigen, Switzerland
Abstract :
Conventional, semiconductor based electronics has its limitations in harsh environments, e.g. operation at low or high temperatures. micro- or nanomechanical switching elements may be an alternative to be used in logic circuits provided that they can be made small and fast enough for useful data processing. in this investigation we demonstrate an integrated micromechanical switch for electric signals based on conventional silicon microprocessing technology. The design allows a significant downscaling towards high density integration.
Keywords :
microswitches; electromechanical microswitches; high density integration; integrated micromechanical switch; nanomechanical switching elements; thermal actuation; Data processing; Integrated circuit technology; Logic circuits; Micromechanical devices; Microswitches; Signal processing; Silicon; Switches; Switching circuits; Temperature;
Conference_Titel :
Microprocesses and Nanotechnology Conference, 2002. Digest of Papers. Microprocesses and Nanotechnology 2002. 2002 International
Conference_Location :
Tokyo, Japan
Print_ISBN :
4-89114-031-3
DOI :
10.1109/IMNC.2002.1178616
