Title :
Development of gold to gold interconnection flip chip bonding for chip on suspension assemblies
Author :
Luk, C.F. ; Chan, Y.C. ; Hung, K.C.
Author_Institution :
Dept. of Electron. Eng., City Univ. of Hong Kong, Kowloon, China
Abstract :
Gold to Gold Interconnection (GGI) flip chip bonding technology has been developed to bond the driver IC chip on the integrated circuit suspension used in hard disk drives (HDDs). GGI is a lead free process where the Au bumps and Au bond pads are joined together by heat and ultrasonic power under a pressure head
Keywords :
disc drives; driver circuits; flip-chip devices; gold; hard discs; integrated circuit bonding; integrated circuit interconnections; ultrasonic bonding; Au bond pad; Au bump; Au-Au; chip-on-suspension assembly; driver IC chip; flip-chip bonding technology; gold-to-gold interconnection; hard disk drive; integrated circuit suspension; lead-free process; thermosonic bonding; ultrasonic bonding; Assembly; Driver circuits; Flip chip; Gold; Integrated circuit interconnections; Integrated circuit technology; Magnetic heads; Magnetic recording; Temperature; Wafer bonding;
Conference_Titel :
Electronic Components and Technology Conference, 2001. Proceedings., 51st
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-7038-4
DOI :
10.1109/ECTC.2001.927942
