DocumentCode :
3166275
Title :
Fabrication and Analysis of High-Q Inductor on Anodized Aluminum for High Power Package
Author :
Lee, Ju-Hyang ; Shin, Seong-Ho ; Kim, K.-M. ; Kwon, Young-Se
Author_Institution :
Telecommun. Network Bus., Samsung Electron. Co. Ltd., Kyungki-do
fYear :
2006
fDate :
10-15 Sept. 2006
Firstpage :
1387
Lastpage :
1390
Abstract :
In this paper, we fabricated high-Q inductors on anodized aluminum substrate using low-k benzocyclobutene (BCB) as an interlayer and thick Cu plating process. The 2 nH inductors on 80 mum anodized aluminum have Q-factor as high as 30 at 2 GHz and self-resonant frequency as high as 11 GHz. Anodized aluminum substrate is useful and cost-effective for high power packaging because of high thermal conductivity. Image current arises on anodized aluminum substrate because aluminum as a conductor is closely located below spiral inductors on anodized aluminum (Al2 O3) layer. Inductances of spiral inductors were calculated considering image current through Grover´s method. Thus, the influence of image current on inductance confirmed through quantitative analysis
Keywords :
Q-factor; aluminium; anodisation; copper; electronics packaging; electroplating; inductors; substrates; thermal conductivity; 11 GHz; 2 GHz; 80 micron; Al; Cu; Grover method; Q-factor; anodized aluminum substrate; high power package; high thermal conductivity; high-Q inductor; image current; interlayer; low-k benzocyclobutene; spiral inductors; Aluminum; Conductors; Fabrication; Frequency; Inductance; Inductors; Packaging; Q factor; Spirals; Thermal conductivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Conference, 2006. 36th European
Conference_Location :
Manchester
Print_ISBN :
2-9600551-6-0
Type :
conf
DOI :
10.1109/EUMC.2006.281295
Filename :
4058093
Link To Document :
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