The novel deflector for multi arrayed microcolumn using MEMS technology

We present a novel design concept of deflectors for a 3 × 3 multiple arrayed microcolumn and its fabrication process using a improved microfabrication and novel MEMS technology, such as multi wafer anodic bonding techniques and copper electroplating for the double metallization process. The double metallization process is a newly introduced interconnection method to reduce wiring among the components. Moreover, a difference in the signal delay between pad site and each deflector pole, which was caused by multi interconnection structure, was calculated using the SPICE simulator with an equivalent circuit model. The calculation results were obtained with about 3ns signal delay difference. Therefore, in these arrayed systems, this method is very useful for checking the difference in signal delay.