DocumentCode
316758
Title
Multiwavelength DFB-LD array module using self-aligned solder bump bonding
Author
Suzuki, N. ; Muroya, Y. ; Sasaki, J. ; Yamada, H. ; Torikai, T.
Author_Institution
Kansai Electron. Res. Lab., NEC Corp., Otsu, Japan
Volume
2
fYear
1997
fDate
22-25 Sep 1997
Firstpage
212
Abstract
Eight-wavelength 1.55-μm DFB-LD array modules with 1.6-nm wavelength spacing have been made by self-aligned assembly using a stripe-type solder bump flip-chip bonding, and the fiber output optical power for each channel was greater than ~20 dBm. These modules are attractive low-cost multiwavelength light sources for use in WDM systems
Keywords
distributed feedback lasers; 1.55 mum; 1.6 nm; WDM system; distributed feedback laser diode; fiber output optical power; low-cost multiwavelength light sources; multiwavelength DFB-LD array module; self-aligned assembly; self-aligned solder bump bonding; stripe-type solder bump flip-chip bonding;
fLanguage
English
Publisher
iet
Conference_Titel
Integrated Optics and Optical Fibre Communications, 11th International Conference on, and 23rd European Conference on Optical Communications (Conf. Publ. No.: 448)
Conference_Location
Edinburgh
ISSN
0537-9989
Print_ISBN
0-85296-697-0
Type
conf
DOI
10.1049/cp:19971454
Filename
628161
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