Integrated single and two-phase micro heat sinks under IGBT chips

Author

Gillot, C. ; Meysenc, L. ; Schaeffer, C. ; Bricard, A.

Author_Institution

Lab. d´´Electrotech. de Grenoble, CNRS, St. Martin d´´Heres, France

Volume

2

fYear

1997

fDate

5-9 Oct 1997

Firstpage

994

Abstract

Experiments have been performed to assess the feasibility of single and two-phase micro heat exchangers applied to the cooling of IGBT power components. After a brief recall of the principal characteristics of such heat exchangers, prototypes that have been built and tested are described. Experimental measurements are then compared to the predictions of the thermal and hydraulic performances with water and the inert fluorocarbon liquid (FC72) as coolant fluids

Keywords

bipolar transistor switches; cooling; heat exchangers; heat sinks; insulated gate bipolar transistors; power bipolar transistors; power semiconductor switches; semiconductor device testing; thermal analysis; IGBT power components; coolant fluids; hydraulic performance prediction; micro heat sinks; performance experiments; semiconductor device cooling; single-phase micro heat exchangers; thermal performance prediction; two-phase micro heat exchangers; Equations; Heat sinks; Heat transfer; Insulated gate bipolar transistors; Prototypes; Silicon; Space heating; Temperature; Thermal conductivity; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Industry Applications Conference, 1997. Thirty-Second IAS Annual Meeting, IAS '97., Conference Record of the 1997 IEEE

Conference_Location

New Orleans, LA

ISSN

0197-2618

Print_ISBN

0-7803-4067-1

Type

conf

DOI

10.1109/IAS.1997.628982

Filename

628982