Title :
Solventless mica tapes for press cure
Author :
Wacker, T.P. ; Miller, G.H. ; Cousins, D.L.
Author_Institution :
Insulating Mater. Inc., Schenectady, NY, USA
Abstract :
During the development of a new epoxy resin rich mica tape for press cure, short and long term property tests were performed. This paper compares the results of testing performed on the new solventless processed tape with the results from conventional solvent processed tapes. This testing demonstrates the capability of solventless manufactured tapes to produce coils with consistently lower dissipation factor tip-up values than conventional mica tapes which are made by coating binders from a solvent solution
Keywords :
coils; composite insulating materials; electric breakdown; epoxy insulation; insulation testing; mica; windings; coating binders; coil insulation; dissipation factor tip-up values; epoxy resin rich mica tape; long-term property tests; press cure; short-term property tests; Coatings; Coils; Epoxy resins; Insulation; Manufacturing; Performance evaluation; Reactive power; Solvents; Temperature; Testing;
Conference_Titel :
Electrical Electronics Insulation Conference, 1995, and Electrical Manufacturing & Coil Winding Conference. Proceedings
Conference_Location :
Rosemont, IL
Print_ISBN :
0-941783-15-4
DOI :
10.1109/EEIC.1995.482498
