DocumentCode :
3169989
Title :
Signal conditioning electronics and packaging for the Alcator C-MOD tokamak
Author :
Parkin, W.
Author_Institution :
Plasma Fusion Center, MIT, Cambridge, MA, USA
fYear :
1991
fDate :
30 Sep-3 Oct 1991
Firstpage :
790
Abstract :
A design utilizing industry-standard EURO card packaging, connected via ribbon cable to a custom I/O backplane, accommodates the many different circuits to be used on Alcator C-MOD. The chassis approach eliminates packaging, powering, and mounting problems associated with one-of-a-kind circuits and allows dense packaging of multiple circuits. The separate I/O backplane allows easy removal and replacement of circuit cards, while leaving front panel space available for circuit-specific indicators. The DIN pin-and-socket connectors are considerably more robust and reliable than edge connectors. The pin-out allows up to four circuits per card, allowing up to eighty channels in one 5-1/2-in-tall, rack mountable chassis. A variety of general-purpose signal conditioning circuit cards was designed and built for engineering and diagnostic systems. Four channel circuits include low-drift integrators, analog multiplexers, temperature controllers, instrumentation amplifiers, transimpedance amplifiers, and an eight-pole Bessel filter for anti-aliasing applications. A two-channel card provides thermal electric cooler control. Fiber-optic interface is provided by an 8-b digital transceiver and an analog fiber-optic link
Keywords :
Tokamak devices; analogue-digital conversion; fusion reactor instrumentation; fusion reactor theory and design; packaging; signal processing; Alcator C-MOD tokamak; DIN pin-and-socket connectors; analog multiplexers; anti-aliasing applications; circuit-specific indicators; diagnostic systems; eight-pole Bessel filter; industry-standard EURO card packaging; instrumentation amplifiers; low-drift integrators; rack mountable chassis; signal conditioning circuit cards; temperature controllers; thermal electric cooler control; transimpedance amplifiers; Backplanes; Connectors; Design engineering; Electronics packaging; Integrated circuit reliability; Power system reliability; Reliability engineering; Robustness; Signal design; Temperature control;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Fusion Engineering, 1991. Proceedings., 14th IEEE/NPSS Symposium on
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-0132-3
Type :
conf
DOI :
10.1109/FUSION.1991.218729
Filename :
218729
Link To Document :
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