Title :
High-k/Metal Gates- from research to reality
Author_Institution :
IBM, Yorktown Heights
Abstract :
Miniaturization of the Si MOSFET required in order to attain higher transistor performance and greater economies of scale have spurred the need for significant materials innovations. This is most apparent in the search for the ideal high-k/metal gate stack as replacement for conventional SiON/Poly-Si gate stacks. In this paper, some of the key advances that have made high-k/metal gate stacks a reality will be reviewed. The innovations included optimized metal and interfaces for improved electron mobility in HfO2/metal gate stacks and insertion of nanoscale gp. IIA and IIIB elements layers between the HfO2 and metal electrode stack for band-edge nMOSFETs. Significant hurdles prevented similar solutions for pMOSFET stacks, primarily due to the presence of thermally activated point defects. However, by careful engineering optimization, pMOSFETs have also been realized, resulting in scalable high performance CMOS using High-k/metal gate stacks.
Keywords :
CMOS integrated circuits; MOSFET; electron mobility; hafnium compounds; high-k dielectric thin films; nanoelectronics; optimisation; CMOS; HfO2; band-edge nMOSFET; electron mobility; high-k/metal gate stacks; nanoscale insertion; optimization; pMOSFET; Economies of scale; Electron mobility; Electrostatics; Hafnium oxide; High K dielectric materials; High-K gate dielectrics; MOSFET circuits; Permission; Technological innovation; Threshold voltage; Electron Mobility; High-k; Metal Gates; Oxygen Vacancies;
Conference_Titel :
Physics of Semiconductor Devices, 2007. IWPSD 2007. International Workshop on
Conference_Location :
Mumbai
Print_ISBN :
978-1-4244-1728-5
Electronic_ISBN :
978-1-4244-1728-5
DOI :
10.1109/IWPSD.2007.4472451