Title :
Ultra low power, harsh environment SOI-CMOS design of temperature sensor based threshold detection and wake-up IC
Author :
Assaad, M. ; Gérard, P. ; Francis, L.A. ; Flandre, D.
Author_Institution :
ICTEAM Inst., Univ. Catholique de Louvain, Louvain-La-Neuve, Belgium
Abstract :
An ultra-low-power temperature-sensor-based silicon-on-insulator (SOI) CMOS Integrated Circuit (IC) for harsh environment application is presented. It first detects a temperature threshold, secondly generates a wake-up signal that turns on a data-acquisition microprocessor once the threshold has been detected and thirdly operates as a temperature sensor in a harsh environment while being wired to the microprocessor kept in a safe area. The IC is continuously on for a very long period of time and is required to be powered from a ultrathin battery type, hence must be an ultra low power design. It includes a diode-based temperature sensor, a quasi-temperature independent voltage generator, a comparator and a power switch to limit the microprocessor stand-by consumption. Since our application is mainly for harsh environment (e.g. high temperature, radiation), the chip has been designed using the 1-μm high-temperature SOI-CMOS XFAB technology; it occupies an area of 560μmxl65μm. The biasing current and power dissipation are 4.12 μA and 20.6 μW respectively at a supply voltage of 5V and temperature of 27°C, according to the post-layout transistor level simulation results.
Keywords :
CMOS integrated circuits; low-power electronics; microprocessor chips; silicon-on-insulator; temperature sensors; comparator; data acquisition microprocessor; diode-based temperature sensor; harsh environment SOI-CMOS design; high-temperature SOI-CMOS XFAB technology; power switch; quasitemperature independent voltage generator; silicon-on-insulator CMOS integrated circuit; temperature threshold; threshold detection; ultra low power SOI-CMOS design; ultrathin battery type; wake-up IC; CMOS integrated circuits; Generators; Low power electronics; Microprocessors; Temperature distribution; Temperature sensors;
Conference_Titel :
SOI Conference (SOI), 2010 IEEE International
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4244-9130-8
Electronic_ISBN :
1078-621x
DOI :
10.1109/SOI.2010.5641369