Integrated low loss RF passive components on glass interposer technology

In this work, a glass interposer layer has been used as the low loss structural medium for the implementation of high performance integrated RF passive components. High frequency characterization of the glass interposer layer, and the design, fabrication, and characterization of glass interposer integrated bandpass filters are detailed. Ring resonators with grounded coplanar waveguide (G-CPW) feedings and different dimensions are used to characterize the glass interposer substrates up to 50 GHz where the relative permittivity and loss tangent could be extracted. Half-mode substrate integrated waveguide (HMSIW) architecture loaded with the complementary split ring resonators (CSRR) is chosen to realize compact resonators and bandpass filters for two ISM bands of 2.4 GHz and 5.8 GHz. Through glass via (TGV) structures are fabricated using a laser fusion process on a glass interposer from Corning Inc. Surface micromachining techniques are used for the fabrication of the proposed devices. The measurement results show less than 1.8 dB insertion loss for the 2-pole bandpass filters in 2.4 and 5.8 GHz bands.