DocumentCode :
3175618
Title :
Design and evaluation of SOI devices for radiation environments
Author :
Schrimpf, Ron D. ; Alles, M.L. ; Fleetwood, D.M. ; Ball, D.R. ; Gadlage, M.J. ; El Mamouni, F.
Author_Institution :
Electr. Eng. & Comput. Sci. Dept., Vanderbilt Univ., Nashville, TN, USA
fYear :
2010
fDate :
11-14 Oct. 2010
Firstpage :
1
Lastpage :
4
Abstract :
SOI technologies offer key advantages for use in radiation environments, primarily related to reduced susceptibility to single-event effects. Because of charge trapping in the BOX, however, SOI technologies with light body doping (such as some fully depleted technologies) may be more sensitive to TID than similar bulk technologies. For sub 100-nm technologies, the advantages of SOI technologies related to SEE are less clear than they were in previous earlier technology generations because the critical charge required to upset the circuits is so low. The probability for upset (cross section), however, is lower for SOI circuits because charge collection does not occur over long distances, as it does in bulk technologies. This also reduces the likelihood that a single particle will affect multiple circuits in an IC.
Keywords :
electron traps; probability; silicon-on-insulator; SOI devices; charge trapping; light body doping; probability; radiation environments; single-event effects; Charge carrier processes; Leakage current; Logic gates; MOSFETs; Silicon; Transient analysis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
SOI Conference (SOI), 2010 IEEE International
Conference_Location :
San Diego, CA
ISSN :
1078-621x
Print_ISBN :
978-1-4244-9130-8
Electronic_ISBN :
1078-621x
Type :
conf
DOI :
10.1109/SOI.2010.5641470
Filename :
5641470
Link To Document :
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