DocumentCode
3176397
Title
SEM PACKAGING OF ADVANCED MODULAR AVIONICS
Author
Nerius, K.
fYear
1995
fDate
5-9 Nov 1995
Firstpage
287
Keywords
Aerospace electronics; Aircraft; Assembly; Backplanes; Bonding; Connectors; Electronics packaging; Heat sinks; Integrated circuit interconnections; Protection;
fLanguage
English
Publisher
ieee
Conference_Titel
Digital Avionics Systems Conference, 1995., 14th DASC
Print_ISBN
0-7803-3050-1
Type
conf
DOI
10.1109/DASC.1995.482842
Filename
482842
Link To Document