A high-frequency transimpedance amplifier for CMOS integrated 2D CMUT array towards 3D ultrasound imaging

Author

Xiwei Huang ; Jia Hao Cheong ; Hyouk-Kyu Cha ; Hongbin Yu ; Minkyu Je ; Hao Yu

Author_Institution

Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore, Singapore

fYear

2013

fDate

3-7 July 2013

Firstpage

101

Lastpage

104

Abstract

One transimpedance amplifier based CMOS analog front-end (AFE) receiver is integrated with capacitive micromachined ultrasound transducers (CMUTs) towards high frequency 3D ultrasound imaging. Considering device specifications from CMUTs, the TIA is designed to amplify received signals from 17.5MHz to 52.5MHz with center frequency at 35MHz; and is fabricated in Global Foundry 0.18-μm 30-V high-voltage (HV) Bipolar/CMOS/DMOS (BCD) process. The measurement results show that the TIA with power-supply 6V can reach transimpedance gain of 61dBΩ and operating frequency from 17.5MHz to 100MHz. The measured input referred noise is 27.5pA/√Hz. Acoustic pulse-echo testing is conducted to demonstrate the receiving functionality of the designed 3D ultrasound imaging system.

Keywords

CMOS integrated circuits; biomedical transducers; biomedical ultrasonics; operational amplifiers; ultrasonic imaging; ultrasonic transducers; CMOS integrated 2D CMUT array; acoustic pulse-echo testing; capacitive micromachined ultrasound transducers; frequency 17.5 MHz to 100 MHz; high frequency 3D ultrasound imaging; high-frequency transimpedance amplifier based CMOS analog front-end receiver; high-voltage bipolar-CMOS-DMOS process; input referred noise; power-supply; transimpedance gain; voltage 6 V; Arrays; Bandwidth; Imaging; Noise; Preamplifiers; Receivers; Ultrasonic imaging;

fLanguage

English

Publisher

ieee

Conference_Titel

Engineering in Medicine and Biology Society (EMBC), 2013 35th Annual International Conference of the IEEE

Conference_Location

Osaka

ISSN

1557-170X

Type

conf

DOI

10.1109/EMBC.2013.6609447

Filename

6609447