Title :
The Growth Behaviors of IMC Layers in Solid-liquid Interfacial Reactions of Sn1.5Cu/Cu in High Magnetic Field
Author :
Cheng, Cong-Qian ; Zhao, Jie ; Xu, Yang ; Xu, Fu-Min ; Huang, Ming-Liang
Author_Institution :
Dalian Univ. of Technol., Dalian
Abstract :
The growth behaviors of intermetallic compound (IMC) layers in solid-liquid interfacial reactions of Sn1.5Cu/Cu in various intensities of high magnetic field have been investigated. The results show that the growth of IMC layers has been accelerated by high magnetic field through the comparison of growth kinetics of IMC layers among OT to 2.5 T magnetic field. IMC grains in high magnetic field are much bigger than that in OT. By the analyzing of XRD patterns of IMC layers, it can be found that the orientations of IMC have been changed by magnetic field.
Keywords :
X-ray diffraction; alloys; copper compounds; metallic thin films; tin compounds; Sn1.5Cu-Cu; XRD patterns; intermetallic compound; intermetallic layers; magnetic field; solid-liquid interfacial reactions; Aging; Bars; Intermetallic; Kinetic theory; Magnetic fields; Materials science and technology; Morphology; Scanning electron microscopy; Solids; X-ray scattering; IMC layer; Sn1.5Cu/Cu; growth behavior; high magnetic field;
Conference_Titel :
High Density packaging and Microsystem Integration, 2007. HDP '07. International Symposium on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-1253-6
Electronic_ISBN :
1-4244-1253-6
DOI :
10.1109/HDP.2007.4283576
