DocumentCode :
3182254
Title :
Advances in Europe - China Green Electronics Collaboration
Author :
Andersen, Otto ; Anderssen, Idun Husabo ; Liu, Johan ; Whalley, David ; Kristiansen, Helge ; Gronlund, Tom Ove ; Bukat, Krystyna ; Lu, Xiuzhen
Author_Institution :
Western Norway Res. Inst, Sogndal
fYear :
2007
fDate :
26-28 June 2007
Firstpage :
1
Lastpage :
4
Abstract :
A newly initiated effort in research on green electronics has resulted in recent advances in the collaboration between China and Europe. The effort was initiated with the research project EC-GEPRO (Europe-China cooperation in green electronics production research). This is funded by the European Commission and engages actors and stimulates high-level debates and cooperation on the development of Green Electronics. This is done through co-organising as well as evaluating the 2nd International Eco-electronics conferences December 7-8, 2006 in Beijing. An evaluation of this conference was carried out by the project, and important issues for improving future collaborative efforts of similar type were identified. In addition to expressing concerns about language and culture gaps, survey respondents placed particular emphasis on the lack of international networks and contacts as a barrier to further international collaboration, whilst suggesting possible ways of overcoming the various obstacles. In addition, the project has co-organised the IEEE CPMT symposium on green electronics in Gothenburg on May 23-24 2007.
Keywords :
ecology; electronics industry; international collaboration; sustainable development; EC-GEPRO project; Europe-China green electronics collaboration; international collaboration; Collaboration; Electronic waste; Electronics packaging; Environmental factors; Europe; Lead; Legislation; Manufacturing processes; Product design; Production;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
High Density packaging and Microsystem Integration, 2007. HDP '07. International Symposium on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-1253-6
Electronic_ISBN :
1-4244-1253-6
Type :
conf
DOI :
10.1109/HDP.2007.4283577
Filename :
4283577
Link To Document :
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