• DocumentCode
    318398
  • Title

    Identification of defective CMOS devices using correlation and regression analysis of frequency domain transient signal data

  • Author

    Plusquellic, James F. ; Chiarulli, Donald M. ; Levitan, Steven P.

  • Author_Institution
    Dept. of Comput. Sci., Pittsburgh Univ., PA, USA
  • fYear
    1997
  • fDate
    1-6 Nov 1997
  • Firstpage
    40
  • Lastpage
    49
  • Abstract
    Transient signal analysis is a digital device testing method that is based on the analysis of voltage transients at multiple test points and on IDD switching transients on the supply rails. We show that it is possible to identify defective devices by analyzing the transient signals produced at test points on paths not sensitized from the defect site. The small signal variations produced at these test points are analyzed in the frequency domain. Correlation analysis shows a high degree of correlation in these signals across the outputs of defect-free devices. We use regression analysis to show the absence of correlation across the outputs of bridging and open drain defective devices
  • Keywords
    CMOS digital integrated circuits; automatic testing; correlation methods; electric current measurement; fault diagnosis; frequency-domain analysis; identification; integrated circuit testing; signal processing; statistical analysis; transients; voltage measurement; waveform analysis; IDD switching transients; bridging; correlation; defect-free devices; defective CMOS devices; defective devices; frequency domain transient signal data; multiple test points; open drain; regression analysis; small signal variations; transient signals; voltage transients; Circuit testing; Frequency domain analysis; Logic testing; Power measurement; Regression analysis; Signal analysis; Signal processing; Transient analysis; Transient response; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference, 1997. Proceedings., International
  • Conference_Location
    Washington, DC
  • ISSN
    1089-3539
  • Print_ISBN
    0-7803-4209-7
  • Type

    conf

  • DOI
    10.1109/TEST.1997.639592
  • Filename
    639592