Abstract :
Epoxy Ring, Cobra, and other new products are evaluated against the demand for high pin count, high frequency, high temperature, multi-DUT, long life, etc. There doesn´t appear to be a single universal solution, but rather each technology provides a usable response to the growing wafer test requirements. However, the climate is right for creativity and innovation to meet the challenges of the future
Keywords :
automatic test equipment; integrated circuit testing; printed circuit testing; Ceprobe; Cobra; Epoxy Ring; high frequency; high pin count; high temperature; membrane probe; multi-DUT; photolithography; universal probe card solution; Aluminum; Atherosclerosis; Circuit testing; Geometry; Gold alloys; Integrated circuit technology; Lead; Probes; Temperature; Tin;
