Title :
MEMS-integrated ultra-wideband terahertz traveling wave tube amplifier
Author :
Shin, Young-Min ; Zhao, Jinfeng ; Barnett, Larry R. ; Luhmann, Neville C., Jr.
Author_Institution :
Dept. of Appl. Sci., Univ. of California-Davis, Davis, CA, USA
Abstract :
An ultra-wideband TWT amplifier is being developed for THz communication, sensing, and imaging applications. Using FDTD-PIC simulation, we demonstrated that, for an electron beam power of 5 kW, a staggered double grating array produces 150 to 275 W, corresponding to 3 - 5.5% efficiency, at 0.22 THz over ~ 30% bandwidth with greater than 12 dB/cm growth rate. The Ka-band cold-test of this circuit has shown excellent agreement with both a theoretical model and simulation analysis in dispersion and attenuation plots, showing a 25% dynamic bandwidth and 0.15 dB/cm attenuation. The circuit has been fabricated by both UV LIGA and high precision CNC machining with ~ 2 - 3 ¿m dimensional tolerance and ~ 30 nm surface roughness and its cold-test setup has been completed. The MEMS-fabricated 0.22 THz electronic circuit will be tested for its dispersion and attenuation measurement. Also, a scandate nano-powder (SC2O3-W) cathode has successfully emitted the requisite high current density electron beam of 80 A/cm2 (space charge limited) at 1150°C for 800 hrs and currently it is planned to incorporate it in the electron gun and PCM magnet design.
Keywords :
finite difference time-domain analysis; micromechanical devices; millimetre wave amplifiers; travelling wave amplifiers; CNC machining; FDTD-PIC simulation; Ka-band cold-test; MEMS-integrated ultra-wideband terahertz traveling wave tube amplifier; UV LIGA; frequency 0.22 THz; power 150 W to 275 W; power 5 kW; scandate nano-powder cathode; surface roughness; temperature 1150 degC; time 800 hr; Analytical models; Attenuation; Bandwidth; Circuit simulation; Circuit testing; Computer numerical control; Electron beams; Gratings; Optical imaging; Ultra wideband technology; MEMS; PCM; SC2O3-W; THz; TWT; UV LIGA; scandate;
Conference_Titel :
Microwave Conference, 2009. APMC 2009. Asia Pacific
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-2801-4
Electronic_ISBN :
978-1-4244-2802-1
DOI :
10.1109/APMC.2009.5385444