Title :
Effects of non-uniform substrate temperature on the clock signal integrity in high performance designs
Author :
Ajami, Amir H. ; Pedram, Massoud ; Banerjee, Kaustav
Author_Institution :
Dept. of Electr. Eng. Syst., Univ. of Southern California, Los Angeles, CA, USA
Abstract :
This paper presents the analysis and modeling of the nonuniform substrate temperature in high performance ICs and its effect on the integrity of the clock signal. Using a novel non-uniform temperature-dependent distributed RC interconnect delay model, the behavior of clock skew in the presence of the substrate thermal gradients is analyzed and some design guidelines are provided to ensure the integrity of the clock signal
Keywords :
delay estimation; digital integrated circuits; integrated circuit interconnections; integrated circuit modelling; substrates; temperature distribution; timing; IC modeling; clock signal integrity; clock skew; design guidelines; distributed RC interconnect delay model; high performance ICs; high performance digital designs; interconnect temperature profile; nonuniform substrate temperature modelling; nonuniform temperature-dependent delay model; substrate thermal gradients; Clocks; Equations; Heat transfer; Integrated circuit interconnections; Signal analysis; Signal design; Space heating; Temperature; Thermal conductivity; Thermal management;
Conference_Titel :
Custom Integrated Circuits, 2001, IEEE Conference on.
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-6591-7
DOI :
10.1109/CICC.2001.929762
