• DocumentCode
    3192608
  • Title

    Frequency recognition methods for dual-frequency SSVEP based brain-computer interface

  • Author

    Min Hye Chang ; Kwang Suk Park

  • Author_Institution
    Interdiscipl. Program for Bioeng., Seoul Nat. Univ., Seoul, South Korea
  • fYear
    2013
  • fDate
    3-7 July 2013
  • Firstpage
    2220
  • Lastpage
    2223
  • Abstract
    Dual-frequency steady-state visual evoked potential (SSVEP) was suggested to generate more stimuli using a few flickering frequencies for brain-computer interface. Dual-frequency SSVEP peaks at more than two frequencies-both main and harmonic frequencies. However multi-frequency recognition strategy has not been investigated for dual-frequency SSVEP. In this paper, three modified power spectral density analysis (PSDA) methods and two modified canonical correlation analysis (CCA) methods were tested for dual-frequency SSVEP classification. Three methods among the five methods used conventional features or classification techniques, and the other two methods used modified features for harmonic frequencies. As a result, CCA with novel features showed the best BCI performance. Also the use of harmonic frequencies improved BCI performance of dual-frequency SSVEP.
  • Keywords
    brain-computer interfaces; correlation methods; electroencephalography; medical signal processing; signal classification; spectral analysis; statistical analysis; visual evoked potentials; BCI performance; brain-computer interface; canonical correlation analysis method; classification technique; dual-frequency SSVEP classification; dual-frequency steady-state visual evoked potential; feature technique; flickering frequency; frequency recognition method; harmonic frequency; power spectral density analysis method; stimuli generation; Accuracy; Brain-computer interfaces; Correlation; Electroencephalography; Harmonic analysis; Signal to noise ratio; Visualization;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society (EMBC), 2013 35th Annual International Conference of the IEEE
  • Conference_Location
    Osaka
  • ISSN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/EMBC.2013.6609977
  • Filename
    6609977