• DocumentCode
    3196128
  • Title

    Fabrication and test of arrays of langasite microbalances

  • Author

    Ansorge, E. ; Brose, A. ; Schmidt, B. ; Sauerwald, J. ; Fritze, H.

  • Author_Institution
    Inst. of Micro- & Sensor Syst. (IMOS), Otto-von-Guericke-Univ., Magdeburg, Germany
  • fYear
    2010
  • fDate
    13-16 Sept. 2010
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    The design of piezoelectricaly actuated plano-convex shaped resonators has been studied to optimize their Q-factor and signal spectrum at high temperatures. The investigated arrays of thickness-shear-mode (TSM) resonators consist of langasite, a high temperature stable material. As viscoelastic damping and an increasing conductivity decreases the Q-factor at elevated temperatures, design optimizations have to counteract these effects. Two and three dimensional finite element (FE) models have been solved to analyze the resonant behavior and the effects of energy confinement at different temperatures depending on geometry. The separation and suppression of spurious modes, the improvement of the Q-factor and the confinement of the TSM could be shown. The simulated effects of energy confinement could be proofed by impedance measurements.
  • Keywords
    Q-factor; crystal resonators; damping; electrical conductivity; finite element analysis; microbalances; viscoelasticity; La3Ga5SiO14; conductivity; high temperature Q-factor; high temperature signal spectrum; langasite microbalance arrays; piezoelectricaly actuated plano-convex shaped resonators; thickness-shear-mode resonators; three dimensional finite element models; two dimensional finite element models; viscoelastic damping; Biomembranes; Finite element methods; Resonant frequency; Temperature; Temperature measurement; Temperature sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic System-Integration Technology Conference (ESTC), 2010 3rd
  • Conference_Location
    Berlin
  • Print_ISBN
    978-1-4244-8553-6
  • Electronic_ISBN
    978-1-4244-8554-3
  • Type

    conf

  • DOI
    10.1109/ESTC.2010.5642800
  • Filename
    5642800