DocumentCode
3198205
Title
Reliability analysis of enhancement-mode GaN MIS-HEMT with gate-recess structure for power supplies
Author
Imada, T. ; Motoyoshi, K. ; Kanamura, M. ; Kikkawa, T.
Author_Institution
Fujitsu Labs. Ltd., Atsugi, Japan
fYear
2011
fDate
16-20 Oct. 2011
Firstpage
38
Lastpage
41
Abstract
In this work, the reliability of enhancement-mode GaN MIS-HEMTs with gate-recess structure was investigated. Stress test under the positive gate bias was mainly considered. By the positive gate bias stress, Ron and Vp was varied. This shift was reversible. The deep-level optical spectroscopy (DLOS) suggested deep levels at the gate recessed region. These results lead to the conclusion that Ron and Vp shift was attributed by the deep level at the gate recessed region. By controlling the trap density at recessed region, we can suppress the Ron and Vp shift.
Keywords
III-V semiconductors; MIS devices; gallium compounds; high electron mobility transistors; semiconductor device reliability; wide band gap semiconductors; DLOS; GaN; deep-level optical spectroscopy; enhancement-mode MIS-HEMT; gate-recess structure; positive gate bias; power supplies; reliability analysis; trap density; Aging; Gallium nitride; HEMTs; Logic gates; MODFETs; Reliability; Stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Reliability Workshop Final Report (IRW), 2011 IEEE International
Conference_Location
South Lake Tahoe, CA
ISSN
1930-8841
Print_ISBN
978-1-4577-0113-9
Type
conf
DOI
10.1109/IIRW.2011.6142584
Filename
6142584
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