• DocumentCode
    3198211
  • Title

    Electromechanical behavior of suspended taut single-walled carbon nanotubes

  • Author

    Akobovitz, Assaf Ya ; Karp, Gabriel ; Hanein, Yael ; Krylov, Slava

  • Author_Institution
    Sch. of Mech. Eng., Tel Aviv Univ., Tel Aviv, Israel
  • fYear
    2009
  • fDate
    9-11 Nov. 2009
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    In this work we present an experimental study of the electromechanical behavior of suspended, taut, single walled carbon nanotubes (SWCNTs). A novel top-down fabrication process was developed in order to integrate the suspended SWCNTs into silicon MEMS structures fabricated using conventional micro-machining techniques. The resonant response of suspended SWCNTs under a time-varying electric field was analyzed and resonant frequencies in MHz range were registered. In addition, the electromechanical characterization of metallic-like, small band-gap-like and semiconductor-like SWCNTs under steady electric fields of varying strength was carried out and high sensitivity of SWCNTs to the gate voltage was observed. The experimental results demonstrate feasibility of the adopted fabrication framework and provide an additional insight into the complex behavior of taut, suspended SWCNT.
  • Keywords
    carbon nanotubes; electromechanical effects; elemental semiconductors; micromachining; micromechanical devices; silicon; Si-C; electromechanical behavior; gate voltage; metallic-like SWCNTs; micromachining; resonant frequency; resonant response; semiconductor-like SWCNTs; silicon MEMS structures; small band-gap-like SWCNTs; suspended taut single-walled carbon nanotubes; top-down fabrication process; Atomic force microscopy; Carbon nanotubes; Electromechanical sensors; Fabrication; Mechanical factors; Microelectromechanical devices; Micromechanical devices; Resonance; Silicon; Sputter etching; Carbon nanotubes; electromechanical behavior; micro-fabrication; resonant operation; single walled carbon nanotubes;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwaves, Communications, Antennas and Electronics Systems, 2009. COMCAS 2009. IEEE International Conference on
  • Conference_Location
    Tel Aviv
  • Print_ISBN
    978-1-4244-3985-0
  • Type

    conf

  • DOI
    10.1109/COMCAS.2009.5385952
  • Filename
    5385952