DocumentCode
3198211
Title
Electromechanical behavior of suspended taut single-walled carbon nanotubes
Author
Akobovitz, Assaf Ya ; Karp, Gabriel ; Hanein, Yael ; Krylov, Slava
Author_Institution
Sch. of Mech. Eng., Tel Aviv Univ., Tel Aviv, Israel
fYear
2009
fDate
9-11 Nov. 2009
Firstpage
1
Lastpage
4
Abstract
In this work we present an experimental study of the electromechanical behavior of suspended, taut, single walled carbon nanotubes (SWCNTs). A novel top-down fabrication process was developed in order to integrate the suspended SWCNTs into silicon MEMS structures fabricated using conventional micro-machining techniques. The resonant response of suspended SWCNTs under a time-varying electric field was analyzed and resonant frequencies in MHz range were registered. In addition, the electromechanical characterization of metallic-like, small band-gap-like and semiconductor-like SWCNTs under steady electric fields of varying strength was carried out and high sensitivity of SWCNTs to the gate voltage was observed. The experimental results demonstrate feasibility of the adopted fabrication framework and provide an additional insight into the complex behavior of taut, suspended SWCNT.
Keywords
carbon nanotubes; electromechanical effects; elemental semiconductors; micromachining; micromechanical devices; silicon; Si-C; electromechanical behavior; gate voltage; metallic-like SWCNTs; micromachining; resonant frequency; resonant response; semiconductor-like SWCNTs; silicon MEMS structures; small band-gap-like SWCNTs; suspended taut single-walled carbon nanotubes; top-down fabrication process; Atomic force microscopy; Carbon nanotubes; Electromechanical sensors; Fabrication; Mechanical factors; Microelectromechanical devices; Micromechanical devices; Resonance; Silicon; Sputter etching; Carbon nanotubes; electromechanical behavior; micro-fabrication; resonant operation; single walled carbon nanotubes;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwaves, Communications, Antennas and Electronics Systems, 2009. COMCAS 2009. IEEE International Conference on
Conference_Location
Tel Aviv
Print_ISBN
978-1-4244-3985-0
Type
conf
DOI
10.1109/COMCAS.2009.5385952
Filename
5385952
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