DocumentCode :
3198262
Title :
Constant voltage electromigration testing
Author :
Lloyd, J.R. ; Connelly, N. ; Zhang, Z. ; Rizzolo, M.
Author_Institution :
SUNY Albany CNSE, Albany, NY, USA
fYear :
2011
fDate :
16-20 Oct. 2011
Firstpage :
55
Lastpage :
58
Abstract :
Constant voltage electromigration was investigated as a method for assessing reliability in narrow Cu conductors. It is demonstrated theoretically that constant voltage (CV) testing can offer advantages over constant current (CC) testing for material that may vary significantly in geometry (thickness or line width) from sample to sample. Using known misprocessed material, this anticipated result was confirmed. Experiments with material that was properly produced showed that the advantages of CV over CC were minimal, but the values of the median time to failure and the lognormal standard deviation of the CC and CV stressed material agreed quite well. A potential difference in the failure distribution was observed, but needs to be confirmed.
Keywords :
conductors (electric); electromigration; reliability; testing; CC stressed material; CC testing; CV stressed material; CV testing; conductors; constant current testing; constant voltage electromigration testing; failure distribution; lognormal standard deviation; misprocessed material; Conductors; Correlation; Current density; Electromigration; Materials; Resistance; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Integrated Reliability Workshop Final Report (IRW), 2011 IEEE International
Conference_Location :
South Lake Tahoe, CA
ISSN :
1930-8841
Print_ISBN :
978-1-4577-0113-9
Type :
conf
DOI :
10.1109/IIRW.2011.6142588
Filename :
6142588
Link To Document :
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