DocumentCode :
3198770
Title :
Tutorials
Author :
Bauza, Daniel ; Ishihara, Ryoichi
Author_Institution :
IMEP-LAHC, MINATEC, Grenoble-France
fYear :
2011
fDate :
16-20 Oct. 2011
Firstpage :
151
Lastpage :
153
Abstract :
Summary form only given. Chip microscale liquid-cooling reduces thermal resistance and improves datacenter efficiency with higher coolant temperatures. This eliminates the need for chillers and allows the thermal energy reuse in cold climates. We demonstrated a 60°C hot water cooled supercomputers with twofold lower energy cost and a fivefold lower carbon footprint. Energy re-use for desalination and adsorption cooling allows close to full use of datacenter heat in all climates. Higher output temperatures for these applications require embedded hotspot adapted cooling. Interlayer cooled 3D chip stacks allow large efficiency gains due to shorter average communication distances.
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Integrated Reliability Workshop Final Report (IRW), 2011 IEEE International
Conference_Location :
South Lake Tahoe, CA
ISSN :
1930-8841
Print_ISBN :
978-1-4577-0113-9
Type :
conf
DOI :
10.1109/IIRW.2011.6142612
Filename :
6142612
Link To Document :
بازگشت