DocumentCode
3200100
Title
New method for head-up display realization by mean of Chip On Board and Aerosol Jet process
Author
Padovani, S. ; Sinesi, S. ; Priante, S. ; Antonipieri, M. ; Negro, A. Del ; Zoellmer, V. ; Maiwald, M. ; Hedges, M.
Author_Institution
Centro Ric. Plast-Opt. S.p.A., Amaro, Italy
fYear
2010
fDate
13-16 Sept. 2010
Firstpage
1
Lastpage
3
Abstract
A new method to fabricate transparent head-up display on glass has been developed. The method exploits the integration of the Aerosol Jet® Process in the Chip On Board technology. The Aerosol Jet® Process is an additive process, which allows the deposition of a wide variety of materials onto a wide variety of substrates without conventional masks or thin-film equipment, but driven by a CAD file (see, e.g.). The process uses aerodynamic focusing to precisely and accurately deposit nano dispersions, so called "functional inks". The process has been used for the printing of thin conductive layout on glass with Ag-nanoparticle based conductive inks. After layout deposition, the chip-LED has been mounted on the glass by means of flip chip process exploiting micro-stamping technique. The developed displays have a luminance higher than 10000 cd/m2 and the visibility trough the glass substrate is fulfills requirements to guarantee the application also on windshield in automotive field.
Keywords
aerosols; automotive electronics; brightness; chip-on-board packaging; flip-chip devices; head-up displays; ink; jets; light emitting diodes; liquid phase deposition; microfabrication; nanofabrication; nanoparticles; printing; silver; Ag; CAD file; SiO2-Jk; aerodynamic focusing; aerosol jet process; automotive field windshield; chip-LED; chip-on-board process; conductive inks; flip chip process; glass substrate; head-up display; layout deposition; luminance; microstamping; nanodispersions; nanoparticle; thin conductive layout printing; transparent head-up display; Aerosols; Glass; Indium tin oxide; Ink; Layout; Printing; Silver;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic System-Integration Technology Conference (ESTC), 2010 3rd
Conference_Location
Berlin
Print_ISBN
978-1-4244-8553-6
Electronic_ISBN
978-1-4244-8554-3
Type
conf
DOI
10.1109/ESTC.2010.5642988
Filename
5642988
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