• DocumentCode
    3200830
  • Title

    Amorphous silicon alloy solar cells and modules-opportunities and challenges

  • Author

    Guha, Subhendu

  • Author_Institution
    United Solar Syst. Corp., Troy, MI, USA
  • fYear
    1996
  • fDate
    13-17 May 1996
  • Firstpage
    1017
  • Lastpage
    1022
  • Abstract
    The low material cost and proven manufacturability of amorphous silicon (a-Si) alloy solar panels make them ideally suited for low-cost terrestrial application. a-Si alloy solar panels have been commercially available for more than a decade for applications ranging from small calculators to large-scale grid-connected power systems. Extensive R&D efforts have resulted in a significant improvement in stable cell and module efficiencies with the achievement of 11.8% cell efficiency and 10.2% module efficiency using a spectral-splitting triple-bandgap, triple-cell approach. Further gains in efficiency are expected through an improved understanding of plasma chemistry and growth kinetics. Large-scale commercialization programs are under way, with proposed expansion of annual production capacities exceeding 25 MW to take place within the next one year. This will make a-Si alloy the dominant photovoltaic technology. In this paper, the author discusses the progress in science, technology and commercialization of a-Si alloy photovoltaics with special emphasis on the opportunities and the challenges that exist
  • Keywords
    amorphous semiconductors; elemental semiconductors; semiconductor device manufacture; silicon; solar cell arrays; solar cells; 10.2 percent; 11.8 percent; R&D efforts; a-Si solar cells; commercialization; growth kinetics; manufacturability; plasma chemistry; solar modules; terrestrial applications; Amorphous silicon; Chemical technology; Commercialization; Costs; Large-scale systems; Manufacturing; Photovoltaic cells; Photovoltaic systems; Silicon alloys; Solar power generation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Specialists Conference, 1996., Conference Record of the Twenty Fifth IEEE
  • Conference_Location
    Washington, DC
  • ISSN
    0160-8371
  • Print_ISBN
    0-7803-3166-4
  • Type

    conf

  • DOI
    10.1109/PVSC.1996.564304
  • Filename
    564304