DocumentCode
3201044
Title
Tiospaye in Engineering and Science: Inculcating a sustained culture for recruiting, retaining, and graduating American Indian students
Author
McNeil, Jacqueline ; Kerk, Carter ; Kellogg, Stuart
Author_Institution
South Dakota Sch. of Mines & Technol., Rapid City, SD, USA
fYear
2011
fDate
12-15 Oct. 2011
Abstract
While the general population of South Dakota is 10 percent American Indian, participation in higher education of this group in South Dakota universities remains relatively low, typically around 1.5 percent. Following best practices developed by American Indian educators and tribal colleges, the South Dakota School of Mines and Technology has developed a new program, Tiospaye in Engineering and Science, which offers a new paradigm for recruitment and support for American Indian students. Following the Lakota word for extended family, Tiospaye, the program provides both scholarship support and positive intervention strategies through an extended campus network of support. The program features extensive classroom support through a combination of campus and small group tutoring sessions, designed within department advisors, and a program mentor that offers one-on-one academic advising and mentoring. In this paper, we describe the recruitment process, positive intervention strategies for academic success, and social support networks. We conclude with a discussion of the current status of the program and early assessment results.
Keywords
recruitment; social networking (online); American Indian educators; academic success; campus network; classroom support; positive intervention strategies; recruitment process; social support networks; students recruitment; Cities and towns; Cultural differences; Educational institutions; Engineering profession; Scholarships; Seminars; American Indian; Extensive classroom support; Positive intervention strategies;
fLanguage
English
Publisher
ieee
Conference_Titel
Frontiers in Education Conference (FIE), 2011
Conference_Location
Rapid City, SD
ISSN
0190-5848
Print_ISBN
978-1-61284-468-8
Electronic_ISBN
0190-5848
Type
conf
DOI
10.1109/FIE.2011.6142784
Filename
6142784
Link To Document