Title :
A Novel Quasi-3-D Threshold Voltage Model for Fully Depleted Quadruple-Gate (FDQG) MOSFETs: With Equivalent Number of Gates (ENG) Included
Author_Institution :
Dept. of Electr. Eng., Nat. Univ. of Kaohsiung, Kaohsiung, Taiwan
Abstract :
Instead of solving the three-dimensional (3-D) Poisson´s equation, we present a novel quasi-3-D threshold voltage model for fully depleted quadruple-gate (QG) MOSFETs based on the minimum central potential derived from the quasi-3-D scaling equation. Accounting for short-channel effects (SCEs) on the device, the natural length of the QG FET in the scaling equation is obtained from the equivalent number of gate equation of 1/ λQG2 = 1/ λDG12+1/ λDG22, where the QG device working in x-y-z space with natural length of λQG can be broken into two equivalent double-gate (DG) FETs with natural lengths of λDG1 and λDG2 working in y-z and x-z planes, respectively. Numerical simulation data for threshold voltage roll-off and drain-induced barrier lowering effects (DIBL) were compared to the model to validate the formula. Among QG FETs with the same perimeters, one with a square cross section will show the worst immunity to SCEs due to the largest natural length. With the criterion of DIBL≤50 mV, an improvement of up to 30% is illustrated in the minimum channel length for the QG MOSFET in comparison to the DG MOSFET.
Keywords :
MOSFET; Poisson equation; numerical analysis; semiconductor device models; 3D Poisson equation; DG FET; DIBL; ENG; FDQG MOSFET; SCE; drain-induced barrier lowering effect; equivalent double-gate FET; equivalent number of gates; fully depleted quadruple-gate MOSFET; numerical simulation; quasi3D scaling equation; quasi3D threshold voltage model; short-channel effect; three-dimensional Poisson equation; threshold voltage roll-off; Equations; Logic gates; MOSFET; Mathematical model; Semiconductor device modeling; Threshold voltage; DIBL; double-gate (DG) MOSFETs; natural length; quadruple-gate (QG) MOSFETs; quasi-3-D scaling equation; threshold voltage roll-off;
Journal_Title :
Nanotechnology, IEEE Transactions on
DOI :
10.1109/TNANO.2013.2284013