Title :
Machine and process capability coefficient of solder paste printers
Author :
Sauer, Wilfried ; Wohlrabe, Heinz
Author_Institution :
Dept. of Electr. Eng., Tech. Univ. Dresden, Germany
Abstract :
For manufacturers of assembled boards seeking ISO 9000 certification, a number of requirements are placed on measurement instruments and tooling. This standard requires a system to document and maintain calibration and machine capabilities. One of these problems is the measurement of printing accuracies of solder paste printers. The paper presents: short theoretical overview of machine capabilities; methods of measurement of accuracies (x, y and rotation); recommendations for the calibration of printers; indications for the sources of inaccuracies; practical examples and results
Keywords :
ISO standards; assembling; calibration; certification; measurement standards; printed circuit manufacture; soldering; ISO 9000 certification; accuracy measurement methods; assembled board manufacture; calibration; documentation; inaccuracy source indications; machine capabilities; machine capability coefficient; measurement instruments; printer calibration; printing accuracy measurement; process capability coefficient; solder paste printers; tooling; Assembly; Building materials; Calibration; Certification; Electric variables measurement; Laboratories; Manufacturing processes; Printers; Printing; Rotation measurement;
Conference_Titel :
Electronics Technology: Concurrent Engineering in Electronic Packaging, 2001. 24th International Spring Seminar on
Conference_Location :
Calimanesti-Caciulata
Print_ISBN :
0-7803-7111-9
DOI :
10.1109/ISSE.2001.931002
