DocumentCode
3203017
Title
DC electrical breakdown of water in a sub-micron planar gap
Author
Song, Chunrong ; Wang, Pingshan
Author_Institution
Department of Electrical & Computer Engineering, Clemson University, SC 29631, USA
fYear
2009
fDate
June 28 2009-July 2 2009
Firstpage
466
Lastpage
469
Abstract
Water breakdown subjected to uniform DC electric field in 300 nm planar gaps is experimentally studied. Test devices with microstrip line configurations are fabricated through nanofabrication technology and the results show that water breakdown occurs at ∼ 100 kV/cm electric field under current system setup. The initiation process of water breakdown in a small gap is discussed. It is most likely being initialized by pre-existed bubbles or bubbles generated from electrolysis of water. Electrode surface roughness is examined and its effect on observed water breakdown is investigated. Therefore, the process for electrode fabrication needs to be carefully chosen and the fabrication procedures need to be optimized to provide smooth surfaces without sharp tips or micro protrusions in future water breakdown investigations.
Keywords
Breakdown voltage; Dielectric breakdown; Electric breakdown; Electrodes; Etching; Fabrication; Gold; Microstrip; Wafer bonding; Water;
fLanguage
English
Publisher
ieee
Conference_Titel
Pulsed Power Conference, 2009. PPC '09. IEEE
Conference_Location
Washington, DC, USA
Print_ISBN
978-1-4244-4064-1
Electronic_ISBN
978-1-4244-4065-8
Type
conf
DOI
10.1109/PPC.2009.5386255
Filename
5386255
Link To Document