DocumentCode
3203079
Title
Analysis of evoked deep brain connectivity
Author
Klimes, Petr ; Janecek, Jiri ; Jurak, P. ; Halamek, J. ; Chladek, Han ; Brazdil, M.
Author_Institution
Inst. of Sci. Instrum., Brno, Czech Republic
fYear
2013
fDate
3-7 July 2013
Firstpage
4358
Lastpage
4361
Abstract
Establishing dependencies and connectivity among different structures in the human brain is an extremely complex issue. Methods that are often used for connectivity analysis are based on correlation mechanisms. Correlation methods can analyze changes in signal shape or instantaneous power level. Although recent studies imply that observation of results from both groups of methods together can disclose some of the basic functions and behavior of the human brain during mental activity and decision-making, there is no technique covering changes in the shape of signals along with changes in their power levels. We present a method using a time evaluation of the correlation along with a comparison of power levels in every available contact pair from intracranial electrodes placed in deep brain structures. Observing shape changes in signals after stimulation together with their power levels provides us with new information about signal character between different structures in the brain during task-related events - visual stimulation with motor response. The results for a subject with 95 intracerebral contacts used in this paper demonstrate a clear methodology capable of spatially analyzing connectivity among deep brain structures.
Keywords
biomedical electrodes; brain; electroencephalography; decision-making; deep brain structures; evoked deep brain connectivity analysis; human brain behavior; intracerebral contacts; intracranial electrodes; mental activity; signal character; visual stimulation; Brain; Correlation; Couplings; Electrodes; Electroencephalography; Standards; Time-frequency analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society (EMBC), 2013 35th Annual International Conference of the IEEE
Conference_Location
Osaka
ISSN
1557-170X
Type
conf
DOI
10.1109/EMBC.2013.6610511
Filename
6610511
Link To Document